Thin film solid-state microbattery packaging

ABSTRACT

Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

BACKGROUND

The subject disclosure relates to microbattery systems, and morespecifically, to solid-state microbattery packaging systems.

SUMMARY

The following presents a summary to provide a basic understanding of oneor more embodiments of the invention. This summary is not intended toidentify key or critical elements, or delineate any scope of theparticular embodiments or any scope of the claims. Its sole purpose isto present concepts in a simplified form as a prelude to the moredetailed description that is presented later. In one or more embodimentsdescribed herein, systems, methods, apparatuses and/or devices thatfacilitate improved solid-state microbattery packaging are described.

According to an embodiment, a system can comprise a substrate layer anda tape substrate layer. The substrate layer can be associated with a setof solid-state microbattery components. The tape substrate layer cancomprises a releasable adhesive material and a polymer sealing material.A conductive surface associated with the set of solid-state microbatterycomponents can be disposed on the releasable adhesive material of thetape substrate layer.

According to another embodiment, a method is provided. The method cancomprise attaching a set of solid-state microbattery components to asurface of a substrate layer that comprises a glass material.Furthermore, the method can comprise disposing a conductive surfaceassociated with the set of solid-state microbattery components onto atape substrate layer that comprises a releasable adhesive material. Themethod can also comprise separating the set of solid-state microbatterycomponents via a laser release process that ablates and de-bonds aninterface between the set of solid-state microbattery components and thetape substrate layer.

According to yet another embodiment, a packaged microbattery device cancomprise a substrate layer, an adhesive layer, an insulator cap layer,and a hermetic coating layer. The substrate layer can comprise aninsulator material. Furthermore, a microbattery can be formed on asurface of the substrate layer. The adhesive layer can comprise areleasable adhesive material. The insulator cap layer can be aligned andbonded onto the microbattery using the adhesive layer. The hermeticcoating layer can couple the microbattery to the substrate layer.

DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram of an example, non-limiting systemassociated with a solid-state microbattery packaging in accordance withone or more embodiments described herein.

FIG. 2 illustrates a block diagram of another example, non-limitingsystem associated with a solid-state microbattery packaging inaccordance with one or more embodiments described herein.

FIG. 3 illustrates a block diagram of yet another example, non-limitingsystem associated with a solid-state microbattery packaging inaccordance with one or more embodiments described herein.

FIG. 4 illustrates a block diagram of an example, non-limiting systemassociated with a laser release process in accordance with one or moreembodiments described herein.

FIG. 5 illustrates a block diagram of an example, non-limiting systemassociated with an array of solid-state microbatteries in accordancewith one or more embodiments described herein.

FIG. 6A illustrates a block diagram of an example, non-limiting processassociated with fabricating solid-state microbattery packaging inaccordance with one or more embodiments described herein.

FIG. 6B also illustrates a block diagram of an example, non-limitingprocess associated with fabricating solid-state microbattery packagingin accordance with one or more embodiments described herein.

FIG. 7 illustrates a block diagram of yet another example, non-limitingsystem associated with a solid-state microbattery packaging inaccordance with one or more embodiments described herein.

FIG. 8 illustrates a block diagram of yet another example, non-limitingsystem associated with a solid-state microbattery packaging inaccordance with one or more embodiments described herein.

FIG. 9 illustrates a flow diagram of an example, non-limiting methodthat facilitates fabrication of a solid-state microbattery packaging inaccordance with one or more embodiments described herein.

FIG. 10 illustrates a flow diagram of another example, non-limitingmethod that facilitates fabrication of a solid-state microbatterypackaging in accordance with one or more embodiments described herein.

FIG. 11 illustrates a flow diagram of yet another example, non-limitingmethod that facilitates fabrication of a solid-state microbatterypackaging in accordance with one or more embodiments described herein.

DETAILED DESCRIPTION

The following detailed description is merely illustrative and is notintended to limit embodiments and/or application or uses of embodiments.Furthermore, there is no intention to be bound by any expressed orimplied information presented in the preceding Background or Summarysections, or in the Detailed Description section.

One or more embodiments are now described with reference to thedrawings, wherein like referenced numerals are used to refer to likeelements throughout. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea more thorough understanding of the one or more embodiments. It isevident, however, in various cases, that the one or more embodiments canbe practiced without these specific details.

A solid-state microbattery can comprise a solid-state electrolyte ratherthan a liquid electrolyte to allow an electrical charge to flow betweenan anode terminal and a cathode terminal of the solid-statemicrobattery. With recent advances in electronic technologies,solid-state microbatteries are becoming more common in electronicdevices. However, batch processing and/or packaging of a large quantityof solid-state microbatteries to facilitate fabrication of solid-statemicrobatteries is often difficult and/or time consuming. Furthermore,singulation of solid-state microbatteries often leads to edge defectsthat allow air leaks in the solid-state batteries. Testing of numeroussolid-state microbatteries is also difficult during fabrication, batchprocessing and/or packaging of the solid-state batteries.

Embodiments described herein include systems, methods, apparatuses anddevices that facilitate improved packaging and/or testing of solid-statebatteries. For example, novel solid-state microbattery packaging and/ornovel solid-state microbattery testing can be provided. In anembodiment, a releasable adhesive material can be employed to provideimproved handling, testing, singulation and/or packaging of solid-statebatteries. In another embodiment, an overmold comprised of a polymersealing material can be applied to seal packaging of solid-statebatteries. In yet another embodiment, a tool can be employed to form anarray of solid-state microbatteries that satisfy a defined criterion(e.g., an array of solid-state microbatteries that are determined to befunctioning properly) on a releasable adhesive material. Additionally oralternatively, a releasable adhesive material can be employed to providestacking of two or more solid-state batteries. In yet anotherembodiment, a releasable adhesive material can be employed totemporarily hold a set of cap wafers for a set of solid-statemicrobatteries to provide stress free bonding and/or sealing of the setof solid-state batteries. In yet another embodiment, a set ofsolid-state microbattery components are formed on a surface of a handlersubstrate layer. The handler substrate layer can be a tape or a glasswith a releasable adhesive material. A conductive surface associatedwith the set of solid-state microbattery components can be disposed onthe releasable adhesive material of the handler substrate layer. Assuch, solid-state microbattery packaging with a molding structure forhermetic or near hermetic packaging around a solid-state microbatterycan be provided. Moreover, impact of laser cutting to an adhesive bondinterface of solid-state microbattery packaging can be reduced in orderto provide an air tight seal for the solid-state microbattery packaging.A batch process can also be improved by employing a releasable adhesivematerial to enable mass production of solid-state microbatterypackaging. Furthermore, a releasable adhesive material can provide anability to test numerous solid-state microbatteries in parallel.Protection of solid-state microbatteries within solid-state microbatterypackaging and/or improved quality of solid-state microbatteries withinsolid-state microbattery packaging can also be provided.

FIG. 1 illustrates a block diagram of an example, non-limiting system100 that facilitates improved solid-state microbattery packaging inaccordance with one or more embodiments described herein. In variousembodiments, the system 100 can be a solid-state microbattery packagingsystem. For example, the system 100 can be a thin film solid-statemicrobattery packaging system. The system 100 can employ a novel device(e.g., novel solid-state microbattery packaging and/or a novelsolid-state microbattery device) that is highly technical in nature,that is not abstract and that cannot be created by a set of mental actsby a human. Further, the system 100 can be employed to solve newproblems that arise through advancements in technology such as, forexample, solid-state microbattery technologies, solid-state microbatterypackaging technologies, circuit technologies, and/or computerarchitecture, and the like. One or more embodiments of the system 100can provide technical improvements to a solid-state microbattery deviceby at least improving quality of a solid-state microbattery, improvingadhesive sealing for a solid-state microbattery, providing a moldingstructure for hermetic or near hermetic packaging for one or moresolid-state batteries, providing air tight sealing for one or moresolid-state batteries, eliminating impact of laser cutting to anadhesive bond interface for one or more solid-state batteries, providinga batch process that enables mass production of solid-state batteries,and/or providing improved testing of numerous solid-state microbatteriesin parallel.

In the embodiment shown in FIG. 1, the system 100 can include asolid-state microbattery component 104 a, a solid-state microbatterycomponent 104 b, a substrate layer 106, a releasable handler layer 108,a cap wafer 107 a, a cap wafer 107 b, polymer sealing material 110 a,and polymer sealing material 110 b. In one example, the releasablehandler layer 108, the polymer sealing material 110 a and/or the polymersealing material 110 b can form an adhesive layer. The solid-statemicrobattery component 104 a can include, for example, an anode, acathode and/or a solid-state electrolyte that form a solid-statemicrobattery. Similarly, the solid-state microbattery component 104 bcan include, for example, an anode, a cathode and/or a solid-stateelectrolyte that form a solid-state microbattery. In one example, thesolid-state microbattery component 104 a and/or the solid-statemicrobattery component 104 b can be a solid-state lithium microbatterycomponent (e.g., a thin film solid-state lithium microbatterycomponent). However, it is to be appreciated that the solid-statemicrobattery component 104 a and/or the solid-state microbatterycomponent 104 b can be a different type of solid-state microbatterycomponent. The substrate layer 106 can be, for example, a handlersubstrate layer that comprises an insulator material, a glass materialor a silicon material. The releasable handler layer 108 can be, forexample, an adhesive layer that is releasable from the cap wafer 107 aand/or the cap wafer 107 b. The polymer sealing material 110 a can be,for example, a polymer adhesive that facilitates bonding between the capwafer 107 a and the substrate layer 106. For example, the polymersealing material 110 a can be a synthetic bonding substance comprised ofpolymers. The polymer sealing material 110 a can also create anair-tight seal for the solid-state microbattery component 104 a. Forinstance, the polymer sealing material 110 a can be an overmoldcomprised of a polymer adhesive to facilitate sealing of the solid-statemicrobattery component 104 a from an external environment (e.g., airsurrounding solid-state microbattery packaging associated with thesolid-state microbattery component 104 a). Similarly, the polymersealing material 110 b can be, for example, a polymer adhesive thatfacilitates bonding between the cap wafer 107 b and the substrate layer106. For example, the polymer sealing material 110 a can be a syntheticbonding substance comprised of polymers. The polymer sealing material110 b can also create an air-tight seal for the solid-state microbatterycomponent 104 b. For instance, the polymer sealing material 110 b can bean overmold comprised of a polymer adhesive to facilitate sealing of thesolid-state microbattery component 104 b from an external environment(e.g., air surrounding solid-state microbattery packaging associatedwith the solid-state microbattery component 104 b).

In an embodiment, the solid-state microbattery component 104 a and thesolid-state microbattery component 104 b can be formed on the substratelayer 106. For example, a conductive surface of the solid-statemicrobattery component 104 a and a conductive surface of the solid-statemicrobattery component 104 b can be in contact with the substrate layer106. Furthermore, the cap wafer 107 a can be formed on the solid-statemicrobattery component 104 a. The cap wafer 107 a can be, for example,an insulator cap layer. The cap wafer 107 a can be aligned and bondedonto the solid-state microbattery component 104 a using the releasablehandler layer 108 and/or the polymer sealing material 110 a. In anaspect, the polymer sealing material 110 a can be in contact with thesolid-state microbattery component 104 a, the substrate layer 106 andthe cap wafer 107 a. The solid-state microbattery component 104 a canalso be disposed within the polymer sealing material 110 a. Forinstance, a first surface of the solid-state microbattery component 104a can be in contact with the substrate layer 106, a second surface ofthe solid-state microbattery component 104 a can be in contact with thecap wafer 107 a, a third surface of the solid-state microbatterycomponent 104 a can be in contact with the polymer sealing material 110a, and a fourth surface of the solid-state microbattery component 104 acan be in contact with the polymer sealing material 110 a. Similarly,the cap wafer 107 b can be formed on the solid-state microbatterycomponent 104 b. The cap wafer 107 b can be, for example, an insulatorcap layer. The cap wafer 107 b can be aligned and bonded onto thesolid-state microbattery component 104 b using the releasable handlerlayer 108 and/or the polymer sealing material 110 b. In an aspect, thepolymer sealing material 110 b can be in contact with the solid-statemicrobattery component 104 b, the substrate layer 106 and the cap wafer107 b. The solid-state microbattery component 104 b can also be disposedwithin the polymer sealing material 110 b. For instance, a first surfaceof the solid-state microbattery component 104 b can be in contact withthe substrate layer 106, a second surface of the solid-statemicrobattery component 104 b can be in contact with the cap wafer 107 b,a third surface of the solid-state microbattery component 104 b can bein contact with the polymer sealing material 110 b, and a fourth surfaceof the solid-state microbattery component 104 b can be in contact withthe polymer sealing material 110 b. As such, the solid-statemicrobattery component 104 a can be associated with a first portion ofthe polymer sealing material 110 a that is separate from a secondportion of the polymer sealing material 110 b associated with thesolid-state microbattery component 104 b. It is to be appreciated that,in certain embodiments, the system 100 can include more than twosolid-state microbattery component (e.g., one or more additionalsolid-state microbattery component than the solid-state microbatterycomponent 104 a and the solid-state microbattery component 104 b).

The releasable handler layer 108 can be, for example, a handlersubstrate layer (e.g., an adhesive substrate layer, a tape substratelayer, etc.). The releasable handler layer 108 can be attached to thecap wafer 107 a and the cap wafer 107 b. Furthermore, the releasablehandler layer 108 can be configured to be removable from the cap wafer107 a and the cap wafer 107 b. In one example, the releasable handlerlayer 108 can comprise a pressure-sensitive tape. In another example,the releasable handler layer 108 be a dicing tape that comprisespolyvinyl chloride, polyolefin, polyethylene or another adhesivematerial. However, it is to be appreciated that the releasable handlerlayer 108 can comprise a different type of releasable adhesive material.In an aspect, the releasable handler layer 108 can be a handler layer tofacilitate handling of the cap wafer 107 a, the cap wafer 107 b, thepolymer sealing material 110 a and/or the polymer sealing material 110b. As such, the releasable handler layer 108 can facilitate improvedbatch transfer and/or bonding of the cap wafer 107 a and the cap wafer107 b onto the solid-state microbattery component 104 a and thesolid-state microbattery component 104 b. Furthermore, the releasablehandler layer 108 can facilitate improved sealing for the solid-statemicrobattery component 104 a and the solid-state microbattery component104 b. Furthermore, the releasable handler layer 108 can facilitateimproved protection of the solid-state microbattery component 104 a andthe solid-state microbattery component 104 b during a shipping process.In certain embodiments, the releasable handler layer 108 can be employedto stack two or more solid-state microbattery components. For example,the releasable handler layer 108 can be employed to stack thesolid-state microbattery component 104 a and the solid-statemicrobattery component 104 b to form a stacked solid-state microbatterypackaging. In one example, the solid-state microbattery component 104 aand the solid-state microbattery component 104 b can be stacked in aserial configuration using the releasable handler layer 108 to providehigher voltage capabilities. In another example, the solid-statemicrobattery component 104 a and the solid-state microbattery component104 b can be stacked in a parallel configuration using the releasablehandler layer 108 to provide higher capacity capabilities. In certainembodiments, a laser release process can separate the solid-statemicrobattery component 104 a and the solid-state microbattery component104 b by cutting through the substrate layer 106 and/or the releasablehandler layer 108 using a laser beam.

FIG. 2 illustrates a top view of an example, non-limiting system 100′ inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

The system 100′ can be an alternate embodiment of the system 100. In theembodiment shown in FIG. 2, the solid state-microbattery component 104 acan correspond to an anode 202 a, a cathode 204 a, a solid-stateelectrolyte 206 a and/or one or more conductive traces 208 a. The anode202 a can be an anode terminal for the solid-state microbatterycomponent 104 a. Furthermore, the cathode 204 a can be a cathodeterminal for the solid-state microbattery component 104 a. Thesolid-state electrolyte 206 a can be a solid-state electrolyte substanceto allow an electrical charge to flow between the anode 202 a and thecathode 204 a of the solid-state microbattery component 104 a. In anaspect, the anode 202 a, the cathode 204 a, and the solid-stateelectrolyte 206 a can be disposed within the polymer sealing material110 a. The one or more conductive traces 208 a can electrically couplethe solid-state microbattery component 104 a to the substrate layer 106and/or one or more external devices. In an embodiment, the one or moreconductive traces 208 a can be coupled to one or more conductiveterminals 210 a formed in the substrate layer 106. Similarly, in theembodiment shown in FIG. 2, the solid state-microbattery component 104 bcan correspond to an anode 202 b, a cathode 204 b, a solid-stateelectrolyte 206 b and/or one or more conductive traces 208 b. The anode202 b can be an anode terminal for the solid-state microbatterycomponent 104 b. Furthermore, the cathode 204 b can be a cathodeterminal for the solid-state microbattery component 104 b. Thesolid-state electrolyte 206 b can be a solid-state electrolyte substanceto allow an electrical charge to flow between the anode 202 b and thecathode 204 b of the solid-state microbattery component 104 b. In anaspect, the anode 202 b, the cathode 204 b, and the solid-stateelectrolyte 206 b can be disposed within the polymer sealing material110 b. The one or more conductive traces 208 b can electrically couplethe solid-state microbattery component 104 b to the substrate layer 106and/or one or more external devices. In an embodiment, the one or moreconductive traces 208 b can be coupled to one or more conductiveterminals 210 b formed in the substrate layer 106. In anotherembodiment, the cap wafer 107 a can be disposed on the anode 202 a andthe cap wafer 107 b can be disposed on the anode 202 b.

FIG. 3 illustrates a top view of an example, non-limiting system 300 inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

The system 300 can be a solid-state microbattery packaging system. Forexample, the system 300 can be a thin film solid-state microbatterypackaging system. The system 300 can include the substrate layer 106,the solid-state microbattery component 104 a, the solid-statemicrobattery component 104 b, and an adhesive layer 302. The adhesivelayer 302 can be, for example, a tape substrate layer. The adhesivelayer 302 can include the releasable handler layer 108, the cap wafer107 a, the cap wafer 107 b, the polymer sealing material 110 a, and thepolymer sealing material 110 b. A first surface of the cap wafer 107 aand a first surface of the cap wafer 107 b can be disposed on thereleasable handler layer 108. Furthermore, the polymer sealing material110 a can be disposed on a second surface of the cap wafer 107 a and thepolymer sealing material 110 b can be disposed on a second surface ofthe cap wafer 107 b. The solid-state microbattery component 104 a andthe solid-state microbattery component 104 b can be formed on a surfaceof the substrate layer 106. In an embodiment, the adhesive layer 302 canbe bonded to the substrate layer 106 to form a solid-state microbatterypackaging system (e.g., to form the system 100 shown in FIG. 1). Forinstance, the polymer sealing material 110 a can be bonded to thesolid-state microbattery component 104 a and/or the substrate layer 106.Furthermore, the polymer sealing material 110 b can be bonded to thesolid-state microbattery component 104 b and/or the substrate layer 106.In certain embodiments, the adhesive layer 302 can be bonded to thesubstrate layer 106 and cured in a vacuum environment. In an embodiment,the system 300 can provide improved batch processing and/or packaging ofat least the solid-state microbattery component 104 a and thesolid-state microbattery component 104 b.

FIG. 4 illustrates a top view of an example, non-limiting system 400 inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

The system 400 can include the substrate layer 106 and solid-statemicrobattery components 104 a-h. In an embodiment, a laser releaseprocess 402 can be performed to remove a solid-state microbatterycomponent 104 a-h (e.g., solid-state microbattery component 104) fromthe substrate layer 106. For instance, a portion 404 of the substratelayer 106 can be cut through via the laser release process 402 tofacilitate removal of a solid-state microbattery component 104 a-h(e.g., solid-state microbattery component 104) from the substrate layer106. In certain embodiments, the releasable handler layer 108 and/or areleasable adhesive material can be employed to facilitate removal of asolid-state microbattery component (e.g., solid-state microbatterycomponent 104 a) from the substrate layer 106. For example, thesolid-state microbattery components 104 a-h can be disposed on a firstsurface of the substrate layer 106. Furthermore, the releasable handlerlayer 108 can be disposed on a second surface of the substrate layer106. As such, in response to the portion 404 of the substrate layer 106being cut via the laser release process 402, the substrate layer 106 canbe turned over using the releasable handler layer 108 to allow thesolid-state microbattery component 104 a to be removed from thesubstrate layer 106. Alternatively, in response to the portion 404 ofthe substrate layer 106 being cut via the laser release process 402, thesubstrate layer 106 can be separated from the releasable handler layer108 to allow the solid-state microbattery component 104 a to be removedfrom the substrate layer 106 and/or the releasable handler layer 108.Furthermore, the laser release process 402 in combination with thesubstrate layer 106 and the releasable handler layer 108 can provide areduced pick and place time for removing one or more solid-statemicrobattery components 104 a-h that are not operating properly. In anembodiment, the laser release process 402 can be performed by a laserdevice that produces a laser beam to cut the portion 404 of thesubstrate layer 106. In another embodiment, the laser release process402 can ablate and/or de-bonds an interface between one or moresolid-state microbattery components 104 a-h (e.g., solid-statemicrobattery component 104 a, etc.) and the releasable adhesive layer108. In yet another embodiment, the laser release process 402 can ablateand/or de-bonds an interface between the substrate layer 106 and thereleasable adhesive layer 108.

FIG. 5 illustrates a top view of an example, non-limiting system 500 inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

The system 500 can include surface 502. In an embodiment, the surface502 can be a releasable handler layer. For instance, the surface 502 cancomprise a releasable adhesive material to facilitate addition and/orremoval of solid-state microbattery components 504 from the surface 502(e.g., from a releasable handler layer). In another embodiment, thesurface 502 can be a substrate layer. For instance, the surface 502 cancomprise an insulator material, a glass material, or a silicon materialto facilitate addition and/or removal of solid-state microbatterycomponents 504 from the surface 502 (e.g., from a substrate layer). Inan aspect, a solid-state microbattery component 504 a from thesolid-state microbattery components 504 can be added to the surface 502.For example, a solid-state microbattery component 504 a from thesolid-state microbattery components 504 can be added to a releasablehandler layer or a substrate layer. Alternatively, the solid-statemicrobattery component 504 a from the solid-state microbatterycomponents 504 can be removed from the surface 502. For example, thesolid-state microbattery component 504 a from the solid-statemicrobattery components 504 can be removed from a releasable handlerlayer or a substrate layer. As such, a solid-state microbatterycomponent (e.g., solid-state microbattery component 504 a) from thesolid-state microbattery components 504 can be individually removablefrom the surface 502 (e.g., individually removable from a releasablehandler layer or a substrate layer). In an aspect, the solid-statemicrobattery components 504 can be arranged as an array of solid-statemicrobattery components on the surface 502. For example, the solid-statemicrobattery components 504 can be arranged as an array of solid-statemicrobattery components on a releasable handler layer or a substratelayer. In certain embodiments, the solid-state microbattery components504 can be tested while disposed on the surface 502. In one example, aprecision pick and place tool can be employed to test the solid-statemicrobattery components 504 disposed on the surface. In another example,more than one solid-state microbattery component from the solid-statemicrobattery components 504 can be concurrently tested while disposed onthe surface 502.

FIG. 6A and FIG. 6B pictorially depict an example process 600 forfabricating a solid-state microbattery packaging system in accordancewith one or more embodiments described herein. Repetitive description oflike elements employed in other embodiments described herein is omittedfor sake of brevity.

With reference to FIG. 6A, presented is a device structure step 602 thatincludes the releasable handler layer 108 and solid-state microbatterycomponents 104 a-c. The solid-state microbattery components 104 a-c canbe formed on a surface of the releasable handler layer 108. For example,an anode, a cathode and/or solid-state electrolyte of the solid-statemicrobattery components 104 a-c can be formed on the releasable handlerlayer 108. In one example, the solid-state microbattery components 104a-c can be deposited on the releasable handler layer 108. For instance,a structure that comprises an anode, a cathode and/or solid-stateelectrolyte can be deposited on the releasable handler layer 108. In anembodiment, electrical terminals of the solid-state microbatterycomponents 104 a-c can be attached to the surface of the releasablehandler layer 108.

At a device structure step 604, polymer sealing material 110 can bedisposed on the solid-state microbattery components 104 a-c and thereleasable handler layer 108. For instance, the polymer sealing material110 can surround the solid-state microbattery components 104 a-c and canbe deposited on the surface of the releasable handler layer 108.

At a device structure step 606, the solid-state microbattery components104 a-c, the releasable handler layer 108 and the polymer sealingmaterial 110 can be rotated. Furthermore, the polymer sealing material110 can be disposed on a surface of the substrate layer 106. In anaspect, at least a portion of the releasable handler layer 108 can beremoved from the polymer sealing material 110. For instance, at least aportion of the releasable handler layer 108 can be pealed off from thepolymer sealing material 110.

With reference to FIG. 6B, presented is a device structure step 608 thatis performed after the device structure step 606 shown in FIG. 6A. Atthe device structure step 608, the releasable handler layer 108 can befully removed from the polymer sealing material 110.

At a device structure step 610, a laser release process can be performedto cut through the polymer sealing material 110 and the substrate layer106. In an aspect, the laser release process can cut through the polymersealing material 110 and the substrate layer 106 to separate thesolid-state microbattery component 104 a from the solid-statemicrobattery component 104 b. For instance, the laser release processcan cut between the solid-state microbattery component 104 a and thesolid-state microbattery component 104 b. The laser release process canalso cut through the polymer sealing material 110 and the substratelayer 106 to separate the solid-state microbattery component 104 b fromthe solid-state microbattery component 104 c. For instance, the laserrelease process can cut between the solid-state microbattery component104 b and the solid-state microbattery component 104 c. In certainembodiments, the substrate layer 106 can also be removed from thepolymer sealing material 110.

FIG. 7 illustrates a top view of an example, non-limiting system 700 inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

The system 700 can be a solid-state microbattery packaging system. Forexample, the system 700 can be a thin film solid-state microbatterypackaging system. The system 700 can include the substrate layer 106,the solid-state microbattery component 104 a, the solid-statemicrobattery component 104 b, and the adhesive layer 302. The adhesivelayer 302 can include the releasable handler layer 108, the cap wafer107 a, the cap wafer 107 b, the polymer sealing material 110 a, thepolymer sealing material 110 b, solder material 702 a and soldermaterial 702 b. A first surface of the cap wafer 107 a and a firstsurface of the cap wafer 107 b can be disposed on the releasable handlerlayer 108. Furthermore, the polymer sealing material 110 a and thesolder material 702 a can be disposed on a second surface of the capwafer 107 a. The polymer sealing material 110 b and the solder material702 b can also be disposed on a second surface of the cap wafer 107 b.The solid-state microbattery component 104 a and the solid-statemicrobattery component 104 b can be formed on a surface of the substratelayer 106. In an embodiment, the adhesive layer 302 can be bonded to thesubstrate layer 106 to form a solid-state microbattery packaging system(e.g., to form the system 100 shown in FIG. 1). For instance, thepolymer sealing material 110 a can be bonded to the solid-statemicrobattery component 104 a and/or the substrate layer 106. The soldermaterial 702 a can also be bonded to an electrical terminal 704 aassociated with the solid-state microbattery component 104 a. Forexample, the electrical terminal 704 a can be electrically coupled tothe solid-state microbattery component 104 a. The solder material 702 acan be a fusible metal alloy to facilitate bonding between the cap wafer107 a and the electrical terminal 704 a. Furthermore, the polymersealing material 110 b can be bonded to the solid-state microbatterycomponent 104 b and/or the substrate layer 106. The solder material 702b can also be bonded to an electrical terminal 704 b associated with thesolid-state microbattery component 104 b. For example, the electricalterminal 704 b can be electrically coupled to the solid-statemicrobattery component 104 b. The solder material 702 b can be a fusiblemetal alloy to facilitate bonding between the cap wafer 107 b and theelectrical terminal 704 b.

FIG. 8 illustrates a top view of an example, non-limiting system 800 inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

The system 800 can be an alternate embodiment of the system 100 and/orthe system 100′. In the embodiment shown in FIG. 8, the solidstate-microbattery component 104 a can correspond to the anode 202 a,the cathode 204 a, the solid-state electrolyte 206 a and/or the one ormore conductive traces 208 a. Similarly, in the embodiment shown in FIG.8, the solid state-microbattery component 104 b can correspond to theanode 202 b, the cathode 204 b, the solid-state electrolyte 206 b and/orthe one or more conductive traces 208 b. The system 800 can also includethe substrate layer 106, the releasable handler layer 108, the cap wafer107 a, the cap wafer 107 b, the polymer sealing material 110 a, thepolymer sealing material 110 b, hermetic coating layer 802 a andhermetic coating layer 802 b. In an embodiment, the hermetic coatinglayer 802 a can be, for example, a metal layer that comprises a metalmaterial to facilitate bonding between the cap wafer 107 a and thesubstrate layer 106. In another embodiment, the hermetic coating layer802 a can be, for example, a glass layer that comprises a glass materialto facilitate bonding between the cap wafer 107 a and the substratelayer 106. Alternatively, the hermetic coating layer 802 a can be, forexample, an insulator layer that comprises an insulator material.Alternatively, the hermetic coating layer 802 a can be, for example, asilicon layer that comprises a silicon material. The hermetic coatinglayer 802 a can also create an air-tight seal for the solid-statemicrobattery component 104 a. Similarly, in an embodiment, the hermeticcoating layer 802 b can be, for example, a metal layer that comprises ametal material to facilitate bonding between the cap wafer 107 b and thesubstrate layer 106. In another embodiment, the hermetic coating layer802 b can be, for example, a glass layer that comprises a glass materialto facilitate bonding between the cap wafer 107 b and the substratelayer 106. Alternatively, the hermetic coating layer 802 b can be, forexample, an insulator layer that comprises an insulator material.Alternatively, the hermetic coating layer 802 b can be, for example, asilicon layer that comprises a silicon material. The hermetic coatinglayer 802 b can also create an air-tight seal for the solid-statemicrobattery component 104 b. It is to be appreciated that, in certainembodiments, the hermetic coating layer 802 a and/or the hermeticcoating layer 802 b can comprise a different type of material tofacilitate a hermetic coating for the solid-state microbattery component104 a and/or the solid-state microbattery component 104 b.

The releasable handler layer 108 can be attached to the cap wafer 107 aand the cap wafer 107 b. Furthermore, the releasable handler layer 108can be configured to be removable from the cap wafer 107 a and the capwafer 107 b. The cap wafer 107 a can be, for example, an insulator caplayer. Furthermore, the cap wafer 107 b can also be, for example, aninsulator cap layer. The cap wafer 107 a can be aligned and bonded ontothe solid-state microbattery component 104 a using the releasablehandler layer 108 and/or the polymer sealing material 110 a (e.g.,adhesive layer 302). Furthermore, the cap wafer 107 b can be aligned andbonded onto the solid-state microbattery component 104 b using thereleasable handler layer 108 and/or the polymer sealing material 110 b(e.g., adhesive layer 302). The hermetic coating layer 802 a can couplethe solid-state microbattery component 104 a to the substrate 106.Similarly, the hermetic coating layer 802 b can couple the solid-statemicrobattery component 104 b to the substrate 106. In one example, thereleasable handler layer 108 can comprise a pressure-sensitive tape. Inanother example, the releasable handler layer 108 be a dicing tape thatcomprises polyvinyl chloride, polyolefin, polyethylene or anotheradhesive material. However, it is to be appreciated that the releasablehandler layer 108 can comprise a different type of releasable adhesivematerial. In an aspect, the releasable handler layer 108 can be ahandler layer to facilitate handling of the cap wafer 107 a, the capwafer 107 b, the polymer sealing material 110 a, the polymer sealingmaterial 110 b, the hermetic coating layer 802 a and/or the hermeticcoating layer 802 b. As such, the releasable handler layer 108 canfacilitate improved batch transfer and/or bonding of the cap wafer 107 aand the cap wafer 107 b onto the solid-state microbattery component 104a and the solid-state microbattery component 104 b. Furthermore, thereleasable handler layer 108 can facilitate improved sealing for thesolid-state microbattery component 104 a and the solid-statemicrobattery component 104 b. Furthermore, the releasable handler layer108 can facilitate improved protection of the solid-state microbatterycomponent 104 a and the solid-state microbattery component 104 b duringa shipping process.

FIG. 9 illustrates a flow diagram of an example, non-limiting method 900that facilitates fabrication of a solid-state microbattery packaging inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

At 902, a set of solid-state microbattery components is attached to asurface of a substrate layer (e.g., substrate layer 106) that comprisesa glass material. A solid-state microbattery component from the set ofsolid-state microbattery components can include, for example, an anode,a cathode and/or a solid-state electrolyte that form a solid-statemicrobattery. In one example, the set of solid-state microbatterycomponents can be a set of solid-state lithium microbattery component.However, it is to be appreciated that the set of solid-statemicrobattery components can be a different type of solid-statemicrobattery components. In an embodiment, the substrate layer can be adevice wafer. In certain embodiments, the set of solid-statemicrobattery components can be arranged on the surface of the substratelayer as an array of solid-state microbattery components on thesubstrate layer.

At 904, it is determined whether there is an additional solid-statemicrobattery component available. If yes, method 900 returns to 902 todispose the additional solid-state microbattery component onto thesurface of the substrate layer. If no, method 900 proceeds to 906.

At 906, a conductive surface associated with the set of solid-statemicrobattery components is disposed onto a tape substrate layer (e.g.,releasable handler layer 108) that comprises a releasable adhesivematerial. The conductive surface can comprise a metal material. In anembodiment, the conductive surface can be a set of cap wafers for theset of solid-state microbattery components. The tape substrate layer canbe configured to be removable from the conductive surface associatedwith the set of solid-state microbattery components. In one example, thetape substrate layer can comprise a pressure-sensitive tape. In anotherexample, the tape substrate layer be a dicing tape that comprisespolyvinyl chloride, polyolefin, polyethylene or another adhesivematerial.

At 908, the set of solid-state microbattery components are separated viaa laser release process that ablates and de-bonds an interface betweenthe set of solid-state microbattery components and the tape substratelayer. For example, the laser release process can separate the set ofsolid-state microbattery components to form individual solid-statemicrobattery components that are sealed by a polymer sealing material.

At 910, it is determined whether there is an additional solid-statemicrobattery component to separate. If yes, method 900 returns to 908 toseparate the additional solid-state microbattery component from one ormore other solid-state microbattery components. If no, method 900proceeds to end.

In certain embodiments, the method 900 can further comprise disposing aset of cap wafers onto the tape substrate layer. Additionally oralternatively, the method 900 can further comprise disposing a polymersealing material onto the set of cap wafers on the releasable adhesivematerial. Additionally or alternatively, the method 900 can furthercomprise disposing a polymer sealing material onto the set ofsolid-state microbattery components. Additionally or alternatively, themethod 900 can further comprise disposing a polymer sealing materialonto the substrate layer.

FIG. 10 illustrates a flow diagram of an example, non-limiting method1000 that facilitates fabrication of a solid-state microbatterypackaging in accordance with one or more embodiments described herein.Repetitive description of like elements employed in other embodimentsdescribed herein is omitted for sake of brevity.

At 1002, a set of solid-state microbattery components is disposed onto asurface of a substrate layer (e.g., substrate layer 106) that comprisesa glass material. A solid-state microbattery component from the set ofsolid-state microbattery components can include, for example, an anode,a cathode and/or a solid-state electrolyte that form a solid-statemicrobattery. In one example, the set of solid-state microbatterycomponents can be a set of solid-state lithium microbattery component.However, it is to be appreciated that the set of solid-statemicrobattery components can be a different type of solid-statemicrobattery components. In an embodiment, the substrate layer can be adevice wafer. In certain embodiments, the set of solid-statemicrobattery components can be arranged on the surface of the substratelayer as an array of solid-state microbattery components on thesubstrate layer.

At 1004, it is determined whether there is an additional solid-statemicrobattery component available. If yes, method 1000 returns to 1002 todispose the additional solid-state microbattery component onto thesurface of the substrate layer. If no, method 1000 proceeds to 1006.

At 1006, a set of cap wafers associated with the set of solid-statemicrobattery components is disposed onto a releasable adhesive material(e.g., releasable handler layer 108) of an adhesive layer. The set ofcap wafers can comprise a metal material associated with the set ofsolid-state microbattery components. The releasable handler layer can beconfigured to be removable from the conductive surface associated withthe set of solid-state microbattery components. In one example, thereleasable handler layer can comprise a pressure-sensitive tape. Inanother example, the releasable handler layer be a dicing tape thatcomprises polyvinyl chloride, polyolefin, polyethylene or anotheradhesive material.

At 1008, a polymer sealing material is disposed onto the set of capwafers. The polymer sealing material can be, for example, a polymeradhesive to facilitate bonding between the set of cap wafers and thesubstrate layer. For instance, the polymer sealing material can be asynthetic bonding substance comprised of polymers. The polymer sealingmaterial can also be employed to create an air-tight seal for the set ofsolid-state microbattery component.

At 1010, the set of cap wafers is disposed onto the surface of asubstrate layer via the polymer sealing material and/or a soldersealant. As such, an air-tight seal for the set of solid-statemicrobattery component can be formed.

FIG. 11 illustrates a flow diagram of an example, non-limiting method1100 that facilitates fabrication of a solid-state microbatterypackaging in accordance with one or more embodiments described herein.Repetitive description of like elements employed in other embodimentsdescribed herein is omitted for sake of brevity.

At 1102, a set of solid-state microbattery components is disposed onto asurface of a substrate layer (e.g., substrate layer 106) that comprisesa glass material. A solid-state microbattery component from the set ofsolid-state microbattery components can include, for example, an anode,a cathode and/or a solid-state electrolyte that form a solid-statemicrobattery. In one example, the set of solid-state microbatterycomponents can be a set of solid-state lithium microbattery component.However, it is to be appreciated that the set of solid-statemicrobattery components can be a different type of solid-statemicrobattery components. In an embodiment, the substrate layer can be adevice wafer. In certain embodiments, the set of solid-statemicrobattery components can be arranged on the surface of the substratelayer as an array of solid-state microbattery components on thesubstrate layer.

At 1104, it is determined whether there is an additional solid-statemicrobattery component available. If yes, method 1100 returns to 1102 todispose the additional solid-state microbattery component onto thesurface of the substrate layer. If no, method 1100 proceeds to 1106.

At 1106, a conductive surface associated with the set of solid-statemicrobattery components is disposed onto a releasable handler layer(e.g., releasable handler layer 108) that comprises a releasableadhesive material. The conductive surface can comprise a metal material.In an embodiment, the conductive surface can be a set of cap wafers forthe set of solid-state microbattery components. The releasable handlerlayer can be configured to be removable from the conductive surfaceassociated with the set of solid-state microbattery components. In oneexample, the releasable handler layer can comprise a pressure-sensitivetape. In another example, the releasable handler layer be a dicing tapethat comprises polyvinyl chloride, polyolefin, polyethylene or anotheradhesive material.

At 1108, the set of solid-state microbattery components on the surfaceof the substrate layer is tested via a microbattery test process. Forexample, two or more solid-state microbattery components from the set ofsolid-state microbattery components can be tested in parallel via themicrobattery test process. The microbattery test process can determinewhether one or more electrical measurements associated with the set ofsolid-state microbattery components satisfies a defined criterion. Assuch, the microbattery test process can determine whether a solid-statemicrobattery component from the set of solid-state microbatterycomponents should be removed from the substrate layer.

At 1110, it is determined whether there is an additional solid-statemicrobattery component to test. If yes, method 1100 returns to 1108 totest the additional solid-state microbattery component onto the surfaceof the substrate layer. If no, method 1100 proceeds to end. In certainembodiments, the method 1100 can comprise removing a solid-statemicrobattery component from the surface of the substrate layer inresponse to a determination, based on the microbattery test process,that the solid-state microbattery component satisfies a definedcriterion.

For simplicity of explanation, the methodologies are depicted anddescribed as a series of acts. It is to be understood and appreciatedthat the subject innovation is not limited by the acts illustratedand/or by the order of acts, for example acts can occur in variousorders and/or concurrently, and with other acts not presented anddescribed herein. Furthermore, not all illustrated acts can be requiredto implement the methodologies in accordance with the disclosed subjectmatter. In addition, those skilled in the art will understand andappreciate that the methodologies could alternatively be represented asa series of interrelated states via a state diagram or events. Theflowchart and block diagrams in the Figures illustrate the architecture,functionality, and operation of possible implementations of systems,methods, apparatuses and devices according to various embodiments of thepresent invention. In some alternative implementations, the functionsnoted in the blocks can occur out of the order noted in the Figures. Forexample, two blocks shown in succession can, in fact, be executedsubstantially concurrently, or the blocks can sometimes be executed inthe reverse order, depending upon the functionality involved.

In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” That is, unless specified otherwise, or clearfrom context, “X employs A or B” is intended to mean any of the naturalinclusive permutations. That is, if X employs A; X employs B; or Xemploys both A and B, then “X employs A or B” is satisfied under any ofthe foregoing instances. Moreover, articles “a” and “an” as used in thesubject specification and annexed drawings should generally be construedto mean “one or more” unless specified otherwise or clear from contextto be directed to a singular form. As used herein, the terms “example”and/or “exemplary” are utilized to mean serving as an example, instance,or illustration. For the avoidance of doubt, the subject matterdisclosed herein is not limited by such examples. In addition, anyaspect or design described herein as an “example” and/or “exemplary” isnot necessarily to be construed as preferred or advantageous over otheraspects or designs, nor is it meant to preclude equivalent exemplarystructures and techniques known to those of ordinary skill in the art.

As it is employed in the subject specification, the term “electronicdevice” can refer to substantially any computing processing unit ordevice comprising, but not limited to, single-core processors;single-processors with software multithread execution capability;multi-core processors; multi-core processors with software multithreadexecution capability; multi-core processors with hardware multithreadtechnology; parallel platforms; and parallel platforms with distributedshared memory. Additionally, an electronic device and/or a processor canrefer to an integrated circuit, an application specific integratedcircuit (ASIC), a digital signal processor (DSP), a field programmablegate array (FPGA), a programmable logic controller (PLC), a complexprogrammable logic device (CPLD), a discrete gate or transistor logic,discrete hardware components, or any combination thereof designed toperform the functions described herein. Further, electronic devicesand/or processors can exploit nano-scale architectures such as, but notlimited to, molecular and quantum-dot based transistors, switches andgates, in order to optimize space usage or enhance performance of userequipment. An electronic device and/or a processor can also beimplemented as a combination of computing processing units.

What has been described above include mere examples of systems andmethods. It is, of course, not possible to describe every conceivablecombination of components or methods for purposes of describing thisdisclosure, but one of ordinary skill in the art can recognize that manyfurther combinations and permutations of this disclosure are possible.Furthermore, to the extent that the terms “includes,” “has,”“possesses,” and the like are used in the detailed description, claims,appendices and drawings such terms are intended to be inclusive in amanner similar to the term “comprising” as “comprising” is interpretedwhen employed as a transitional word in a claim.

The descriptions of the various embodiments have been presented forpurposes of illustration, but are not intended to be exhaustive orlimited to the embodiments disclosed. Many modifications and variationswill be apparent to those of ordinary skill in the art without departingfrom the scope and spirit of the described embodiments. The terminologyused herein was chosen to best explain the principles of theembodiments, the practical application or technical improvement overtechnologies found in the marketplace, or to enable others of ordinaryskill in the art to understand the embodiments disclosed herein.

What is claimed is:
 1. A device, comprising: a substrate layer having aplurality of solid-state microbattery components disposed on a surfaceof the substrate layer; and a tape substrate layer that comprises areleasable adhesive material, a first polymer sealing material and asecond polymer sealing material, wherein a conductive surface associatedwith the plurality of solid-state microbattery components is disposedunder the releasable adhesive material of the tape substrate layer; afirst cap wafer disposed on a first anode terminal of a firstsolid-state microbattery component of the plurality of solid-statemicrobattery components; a second cap wafer disposed on a second anodeterminal of a second solid-state microbattery component of the pluralityof solid-state microbattery components, wherein the first cap wafer is afirst component and the second cap wafer is a second component, thefirst cap wafer and the second cap wafer being separate components, andthe first polymer sealing material bonds the first cap wafer and thesubstrate layer, and the second polymer sealing material bonds thesecond cap wafer and the substrate layer, wherein the second polymersealing material is separate from the first polymer sealing material. 2.The device of claim 1, wherein the first anode terminal and a firstcathode terminal of the first solid-state microbattery component of theplurality of solid-state microbattery components are disposed within thefirst polymer sealing material of the tape substrate layer, and whereinthe second anode terminal and a second cathode terminal of the secondsolid-state microbattery component of the plurality of solid-statemicrobattery components are disposed within the second polymer sealingmaterial of the tape substrate layer.
 3. The device of claim 1, whereinthe first solid-state microbattery component of the plurality ofsolid-state microbattery components is associated with the first polymersealing material, which is separate from the second polymer sealingmaterial associated with the second solid-state microbattery componentof the plurality of solid-state microbattery components.
 4. The deviceof claim 1, wherein the plurality of solid-state microbattery componentsare arranged as an array of solid-state microbattery components on thesubstrate layer.
 5. The device of claim 1, wherein each of the pluralityof solid-state microbattery components formed on the substrate layercomprises a respective solid-state electrolyte.
 6. The device of claim1, wherein the substrate layer and the tape substrate layer facilitatesimproved quality of the plurality of solid-state microbatterycomponents.